PU Potting

Balanced Hardness with Slight Flexibility – Cures to a tough semi-rigid layer that protects components while absorbing limited stress to avoid cracking like rigid epoxy.

Excellent Shock and Impact Resistance – Withstands drops, impacts, and handling, preventing PCB and component damage.

Superior Moisture and Chemical Protection – Creates a barrier against humidity, salt mist, oils, and industrial chemicals for long-term field reliability.

Good Thermal Stability – Performs across wide temperature variations and repeated heating/cooling cycles without becoming brittle.

Strong Adhesion to Plastics and Metals – Bonds firmly to PCB substrates, housings, and metallic parts, preventing delamination over time.

Better Reworkability Compared to Epoxy – Can be cut, drilled, or partially removed for servicing, unlike rigid epoxy systems.

Maintains Strong Electrical Insulation Over Time – High dielectric strength prevents short circuits, arcing, and breakdown even in humid conditions.

Vibration & Shock Absorption: Damps mechanical shock and vibration to protect sensitive components.

Thermal Cycling Tolerance: Expands and contracts with temperature change without cracking or stressing the PCB.

Prevents Micro-Cracks: Elastic nature avoids micro-cracking that can lead to moisture ingress and failure.

Moisture & Chemical Resistance: Shields electronics from humidity, salt mist, oils, dust, and harsh environments.

Low Internal Stress: Soft cured resin minimizes strain on SMDs, coils, sensors, and connectors.

Easy Rework & Repair: Can be cut or peeled for servicing, unlike rigid potting that permanently locks components.

Plastic Housing Compatibility: Flexibility prevents stress cracking of plastic enclosures during use.

Stable Electrical Insulation: Maintains high dielectric insulation even during bending, vibration, and movement.